Vibration fatigue analysis of solder joints
We propose an efficient vibration fatigue analysis environment for solder joints and bus bars on electronic substrates!
Magma International Japan Co., Ltd. conducts an efficient vibration fatigue analysis process for electronic substrates. Fatigue analysis under various excitation conditions can be performed from a single structural analysis result. This analysis is suitable for various industries, including the automotive industry, and for those facing challenges in fatigue analysis. 【Features】 ■ A post-process that efficiently extracts critical areas for fatigue from countless solder joints ■ Enables fatigue analysis under various excitation conditions from a single structural analysis result ■ Verifies the impact of different solder shapes on fatigue life ■ Optimizes the fatigue strength of electronic substrates by relocating heavy objects and grounding damping materials ■ Allows evaluation of the electronic substrate body, such as non-metals and PCBs *For more details, please refer to the PDF materials or feel free to contact us.
